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Posters (16) - Alphabetical order |
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Poster nº
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Author & Title
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Abstract
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| 1 |
Maurice Clair (3D-Micromac AG, Germany)
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Laser-Based Annealing of Nickel Contacts for SiC Devices: Towards Thermally Robust Power Interfaces in 3D-Integration
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| 2 |
Mathias Franz (Fraunhofer ENAS, Germany)
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Atomic Layer Deposition of Titanium Oxide for Integrated Applications
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| 3 |
Daniel Grieve (Infineon Technologies Dresden AG & Co KG, Germany)
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Investigation of the oxidation and reduction behavior of thin copper surfaces in semiconductor technology
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| 4 |
Conrad Guhl (Fraunhofer IPMS, Germany)
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Characterization of interactive forces between CMP pad and ILD materials depending on post CMP clean
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| Late 1 |
Matteo Gullo (STMicroelectronics, Italy)
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Monitoring-Based Control and Process Interruptions Recovery Strategies for Slurry Residues in Serial CMP of IMD Oxides
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| 5 |
Sergej Liberda (Fraunhofer IPMS CNT, Germany)
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300 mm CMOS Compatible ZrN based SC BEOL Demonstrator & Trench-Array Structures for Testing Via Superconductivity
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| 6 |
Christian Miersch (Fraunhofer Technology Center High-Performance Materials THM, Germany)
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Plasma enhanced Atomic Layer Etching on AlGaN/GaN: process development, stability, recess etching of source, drain and gate
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| Late 2 |
Takayuki Ohba (Institute of Science Tokyo, Japan)
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Development of a WOW-Compatible Chiplet-Based COW Process
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| Late 3 |
Luca Pessina (STMicroelectronics, Italy)
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Effect of conditioning downforce on Removal Rate stability for ILD CMP application using a ceria-based slurry
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| 7 |
Sakshi Pharsole (Fraunhofer Institute for Electronic Nano Systems ENAS, Germany)
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Investigation of Au-Si Eutectic Bonding for MEMS Wafer-Level Packaging Application
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| 8 |
Ilaria Presotto (STMicroeletronics, Italy)
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Data-driven resolution of processability issues in technology scale-up
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| 9 |
Namitha Reghunath (TU Chemnitz, Germany)
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Simulation of Metal-Assisted Halogen-Free Etching of Silicon Using Ruthenium Catalyst
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| Late 4 |
Simone Rizzardini (STMicroelectronics, Italy)
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Statistical Modeling of Sub-Pad Mechanical Properties Impact on Edge Removal Modulation in Copper CMP
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| 10 |
Matthias Stender (ChEmpower Corporation, USA)
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Advanced node process characterization: novel chemical mechanical polishing with environmentally friendly abrasive free setup
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| 11 |
Oytun Tasgit (3D-Micromac AG, Germany)
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Ultrafast Laser-Based Sample Preparation for Optimized FIB/SEM Workflows in High-Throughput Analysis
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| 12 |
Roman Tschagaew (Institut für Angewandte Physik, TU Bergakademie Freiberg, Germany)
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Towards a calibrated TCAD model of an AlGaN/GaN HEMT device
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| 16/16 |
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