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Maurice Clair (3D-Micromac AG, Germany)
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Laser-Based Annealing of Nickel Contacts for SiC Devices: Towards Thermally Robust Power Interfaces in 3D-Integration
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Mathias Franz (Fraunhofer ENAS, Germany)
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Atomic Layer Deposition of Titanium Oxide for Integrated Applications
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Daniel Grieve (Infineon Technologies Dresden AG & Co KG, Germany)
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Investigation of the oxidation and reduction behavior of thin copper surfaces in semiconductor technology
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Conrad Guhl (Fraunhofer IPMS, Germany)
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Characterization of interactive forces between CMP pad and ILD materials depending on post CMP clean
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Felix Köhler (Fraunhofer Institute for Photonic Microsystems IPMS, Germany)
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Advanced node process characterization: novel chemical mechanical polishing with environmentally friendly abrasive free setup
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Sergej Liberda (Fraunhofer IPMS CNT, Germany)
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300 mm CMOS Compatible ZrN based SC BEOL Demonstrator & Trench-Array Structures for Testing Via Superconductivity
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Sakshi Pharsole (Fraunhofer Institute for Electronic Nano Systems ENAS, Germany)
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Investigation of Au-Si Eutectic Bonding for MEMS Wafer-Level Packaging Application
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Ilaria Presotto (STMicroeletronics, Italy)
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Data-driven resolution of processability issues in technology scale-up
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Namitha Reghunath (TU Chemnitz, Germany)
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Simulation of Metal-Assisted Halogen-Free Etching of Silicon Using Ruthenium Catalyst
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Oytun Tasgit (3D-Micromac AG, Germany)
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Ultrafast Laser-Based Sample Preparation for Optimized FIB/SEM Workflows in High-Throughput Analysis
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Roman Tschagaew (Institut für Angewandte Physik, TU Bergakademie Freiberg, Germany)
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Towards a calibrated TCAD model of an AlGaN/GaN HEMT device
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| 5/11 |
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