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| KEYNOTE |
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| INVITED MAM2026 |
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Tatsuya Funaki |
Institute of Science Tokyo and Murata Manufacturing Co., Ltd. |
Japan |
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Himendra Jha |
MKS/ATOTECH |
Germany |
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Luca Larcher |
Applied Materials Inc. |
USA |
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Nicolas Posseme |
CEA-LETI |
France |
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Danny Reuter |
Chemnitz University / Fraunhofer ENAS |
Germany |
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Amandine Saint-Blancat |
STMicroelectronics Rousset |
France |
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Jean-Philippe Soulié |
imec |
Belgium |
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Davide Tierno |
imec |
Belgium |
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| INVITED WORKSHOP |
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Stéphane Bernabé |
CEA-LETI |
France |
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Gerald Beyer |
imec |
Belgium |
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Frank Fournel |
CEA-LETI |
France |
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| KEYNOTE |
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Claire Fenouillet-Beranger (CEA-LETI, France)
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Progress on 10 nm FDSOI
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| INVITED MAM2026 |
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Tatsuya Funaki (Institute of Science Tokyo and Murata Manufacturing Co., Ltd., Japan)
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Chip-on-Wafer Integration Technology for Silicon Capacitor Embedded 3D Functional Interposer
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Himendra Jha (MKS/ATOTECH, Germany)
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Next-Generation Electrolytes for High-Precision Micro Bump Integration
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Luca Larcher (Applied Materials Inc., USA)
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Material-electrical modeling of interconnect: challenges and opportunities
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Nicolas Posseme (CEA-LETI, France)
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Benefit of post etch treatment for defectivity improvement in the BEOL
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Danny Reuter (Chemnitz University / Fraunhofer ENAS, Germany)
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Sustainable processing in microelectronics manufacturing
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Amandine Saint-Blancat (STMicroelectronics Rousset, France)
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Eco-conception for BEOL processes: application to industrial clean room platform
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Jean-Philippe Soulié (imec, Belgium)
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Multilayer PtCoO2 Delafossite thin films for future interconnect metallization
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Davide Tierno (imec, Belgium)
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Ruthenium‑Based BEOL Integration Schemes for Scaled Interconnects
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| INVITED WORKSHOP |
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Stéphane Bernabé (CEA-LETI, France)
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Wafer level technologies for Heterointegration of Photonics Modules
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Gerald Beyer (imec, Belgium)
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Challenges and opportunities of 3D system integration
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Frank Fournel (CEA-LETI, France)
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How wafer direct bonding mechanism enable die to wafer technology
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