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| KEYNOTE |
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| INVITED MAM2026 |
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Maurice Clair |
3D-Micromac AG |
Germany |
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Tatsuya Funaki |
Institute of Science Tokyo and Murata Manufacturing Co., Ltd. |
Japan |
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Himendra Jha |
MKS/ATOTECH |
Germany |
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Alberto Mancaleoni |
STMicroelectronics |
Italy |
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Alessandro Mapelli |
Confovis |
Germany |
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Nicolas Posseme |
CEA-LETI |
France |
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Danny Reuter |
Chemnitz University / Fraunhofer ENAS |
Germany |
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Tommaso Rollo |
Applied Materials Inc. |
Italy |
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Amandine Saint-Blancat |
STMicroelectronics Rousset |
France |
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Jean-Philippe Soulié |
imec |
Belgium |
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Davide Tierno |
imec |
Belgium |
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| INVITED WORKSHOP |
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Stéphane Bernabé |
CEA-LETI |
France |
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Gerald Beyer |
imec |
Belgium |
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Frank Fournel |
CEA-LETI |
France |
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Nathanael Joehrmann |
TU Chemnitz |
Germany |
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Jens Stolze |
Applied Materials Europe |
Germany |
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Klaus Vogel |
Fraunhofer ENAS |
Germany |
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| KEYNOTE |
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Claire Fenouillet-Beranger (CEA-LETI, France)
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Key building blocks driving the developments of FD-SOI 10nm node
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| INVITED MAM2026 |
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Maurice Clair (3D-Micromac AG, Germany)
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From Full-Field to Single-Spot: Laser-Based Processing for Microelectronics
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Tatsuya Funaki (Institute of Science Tokyo and Murata Manufacturing Co., Ltd., Japan)
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Chip-on-Wafer Integration Technology for Silicon Capacitor Embedded 3D Functional Interposer
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Himendra Jha (MKS/ATOTECH, Germany)
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Next-Generation Electrolytes for High-Precision Micro Bump Integration
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Alberto Mancaleoni (STMicroelectronics, Italy)
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Hi-Temperature Lifetime Capability of CuAl Intermetallic Joints: Comparative Study of Pure and Alloyed Copper Wires through Electrical and Physical Methods
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Alessandro Mapelli (Confovis, Germany)
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Co-Registered Automated Optical Inspection and Metrology for C4/TCB Micro-Bumps with Infrared Structured Illumination Microscopy of Bonded Interfaces
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Nicolas Posseme (CEA-LETI, France)
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Benefit of post etch treatment for defectivity improvement in the BEOL
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Danny Reuter (Chemnitz University / Fraunhofer ENAS, Germany)
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Sustainable processing in microelectronics manufacturing
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Tommaso Rollo (Applied Materials Inc., Italy)
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Material-electrical modeling of interconnect: challenges and opportunities
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Amandine Saint-Blancat (STMicroelectronics Rousset, France)
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Eco-conception for BEOL processes: application to industrial clean room platform
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Jean-Philippe Soulié (imec, Belgium)
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Multilayer PtCoO2 Delafossite thin films for future
interconnect metallization
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Davide Tierno (imec, Belgium)
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Ruthenium Based BEOL Integration Schemes for Scaled Interconnects
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| INVITED WORKSHOP |
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Stéphane Bernabé (CEA-LETI, France)
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Wafer level technologies for Heterointegration of Photonics Modules
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Gerald Beyer (imec, Belgium)
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Challenges and opportunities of 3D system integration
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Frank Fournel (CEA-LETI, France)
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How wafer direct bonding mechanism enables die-to-wafer technology
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Nathanael Joehrmann (TU Chemnitz, Germany)
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Multi-scale thermo-mechanics for electronics packaging
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Jens Stolze (Applied Materials Europe, Germany)
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Interconnects for Heterointegration schemes on Wafer and Panel level
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Klaus Vogel (Fraunhofer ENAS, Germany)
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Low temperature metallic wafer level bonding with selective heat input
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