Stéphane Bernabé received the M.Sc. degree in Physics and Photonics engineering from the University Louis Pasteur of Strasbourg, France, in 1997. The same year, he graduated from the Ecole Nationale Supérieure de Physique de Strasbourg (ENSPS).
He has been R&D engineer and project leader in the field of optoelectronic packaging in companies Wavetek Wandel Goltermann (now Viavi), Radiall and Intexys Photonics, in charge of fiber optic module developments. In 2007 he joined the CEA-LETI Institute in Grenoble, France, in the Optics and Photonics Department, and has been involved in several research dealing with optoelectronic device packaging (Photonic Integrated Circuits, LED modules, components reliability, multiphysics modelling), and application of Silicon Photonics to Data communications and optical Networks on Chips (oNoC) for computing. He has been involved in several Europe and national funded R&D projects, pioneering Silicon Photonics in Europe. He is now heading the Photonics Packaging Lab at CEA-LETI, Grenoble, France.
Mr. Bernabé has published 60 papers, 17 patents, and co-authored 3 book chapters. His current interests are in Photonic/Electronic co-integration leveraging advanced packaging technologies, and PIC optical coupling. He is actively participating in ECTC and ESTC conference committees, and is a member of IEEE EPS.

Frank Fournel graduated from ESPCI (Paris) with a master in Materials Science, and got his PhD in 2001. He has been employed by CEA since 2001. He is now at the head of the wafer bonding technology engineering in LETI and board member of the international ECS Wafer Bonding Symposium conference, the International Wafer’Bond conference and the Low Temperature Bonding 3D conference. He has more than 231 international publications with an h-index of 29, 133 deposited patents. He passed his HDR in 2009. He his French Research Director since 2021. He is CEA Fellow since 2023

Dr. Himendra Jha is a senior scientist at MKS-Atotech, specializing in semiconductor metallization. He has received PhD from Hokkaido University, Japan in 2008. He worked in multiple scientific Institutions until he joined MKS Atotech in 2014. With over 15 years of experience in electrochemical materials science, he is a leading expert in the area of metallization for Cu bump, lead-free soldering, bond-pad as well as solar energy conversion and energy storage (Li-ion battery).

Luca Larcher, former professor at the University of Modena and Reggio Emilia and currently at Applied Materials, where he works on the development of modeling tools (Ginestra simulation platform)

Nicolas Posseme received an Engineer degree in Plasma in 2001 from Polytech Orleans, a Ph.D. degree in microelectronics in 2005 for his work on Low k film etching and a HDR degree in 2014. He joined the CEA-Leti in 2005. First, he joined ST Crolles as CEA-Leti assignee in etch R&D focused in the BEOL. In 2009, he joined IBM Alliance in Albany as Leti assignee to contribute to the development of FDSOI technology. Within Albany state of the art facilities, he worked on device integration to improve the performance of FDSOI devices. In 2011, he moved to AMAT in Sunnyvale as Leti assignee where he worked on the development of disruptive etch processes (FEOL and BEOL). Back in France in 2013, he was deputy head of etch and stripping lab. In 2016, he joined Global Foundries in Dresden as Leti assignee participating in the development of 22FDX and 12FDX technologies as etch and process integration expert. Back in France in 2019, he was head of etch and stripping lab as well as in charge of the engineering (etch and stripping) at Leti. Then he joined beginning 2023 ST Crolles as senior member of technical staff in R&D etch group. He is recently back at CEA-LETI as process integration expert for optical applications. Nicolas Posseme authored and co-authored over 100 papers and has filed 100 patents. He has also given more than 170 oral presentations at international conferences.