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Tue 24 |
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Wed 25 |
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Thu 26 |
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Workshop “Technologies for heterointegration and chiplets” |
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10:30-10:45 |
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Welcome and Opening |
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Chairperson: To be defined |
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10:45-11:30 |
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INVITED |
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Challenges and opportunities of 3D system integration |
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Gerald Beyer,
imec, Belgium |
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11:30-12:15 |
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INVITED |
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How wafer direct bonding mechanism enables die-to-wafer technology |
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Frank Fournel,
CEA-LETI, France |
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Chairperson: To be defined |
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13:15-14:00 |
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INVITED |
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Low temperature metallic wafer level bonding with selective heat input |
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Klaus Vogel,
Fraunhofer ENAS, Germany |
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14:00-14:45 |
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INVITED |
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Wafer level technologies for Heterointegration of Photonics Modules |
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Stéphane Bernabé,
CEA-LETI, France |
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Chairperson: To be defined |
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15:15-16:00 |
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INVITED |
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Interconnects for Heterointegration schemes on Wafer and Panel level |
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Jens Stolze,
Applied Materials Europe, Germany |
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16:00-16:45 |
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INVITED |
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Multi-scale thermo-mechanics for electronics packaging |
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Nathanael Joehrmann,
TU Chemnitz, Germany |
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16:45-16:55 |
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Closing Remarks |
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