|
|
|
|
|
|
|
|
|
|
|
|
|
Tue 24 |
|
Wed 25 |
|
Thu 26 |
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
Session 9 - Interconnects & Process Integration |
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
Chairperson: Stefan E. Schulz |
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
08:30-09:00 |
|
INVITED |
|
Multilayer PtCoO2 Delafossite thin films for future
interconnect metallization
|
|
Jean-Philippe Soulié,
imec, Belgium |
|
 |
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
09:00-09:30 |
|
INVITED |
|
Benefit of post etch treatment for defectivity improvement in the BEOL |
|
Nicolas Posseme,
CEA-LETI, France |
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
09:30-09:50 |
|
|
A Novel Thermally Stable Ruthenium Precursor Enabling Dense, Lower Resistivity and Inherent Selectivity against SiO2 via Atomic Layer Deposition for Advanced Interconnects |
|
Hideaki Nakatsubo,
Tanaka Precious Metal Technologies, Japan |
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
09:50-10:10 |
|
|
Underlayer selection for TiSiN ALD deposition on Copper thin film |
|
Hugo Nuez,
STMicroelectronics, France |
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
10:10-10:40 |
|
INVITED |
|
Ruthenium Based BEOL Integration Schemes for Scaled Interconnects |
|
Davide Tierno,
imec, Belgium |
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
10:40-10:50 |
|
Closing remarks: Stefan E. Schulz |
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
10:50-11:30 |
|
Farewell coffee |
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
. |
|
|
|
|
|
|
|
|
|
|
|
|
