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Tue 24 |
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Wed 25 |
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Thu 26 |
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09:00-09:20 |
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Welcome and Opening |
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Chairperson: Stefan E. Schulz |
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09:20-10:00 |
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KEYNOTE |
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Key building blocks driving the developments of FD-SOI 10nm node |
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Claire Fenouillet-Beranger,
CEA-LETI, France |
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Session 2 – Sustainability |
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Chairperson: Fabrice Nemouchi |
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10:00-10:30 |
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INVITED |
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Eco-conception for BEOL processes: application to industrial clean room platform |
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Amandine Saint-Blancat,
STMicroelectronics Rousset, France |
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10:30-10:50 |
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PFAS-free Polyimide Passivation Thin Films in Advanced Metallization Stacks: Advanced Characterization, FEM Modeling, and Comparison with Conventional Polymers |
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André Clausner,
Fraunhofer IKTS, Germany |
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10:50-11:20 |
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Coffee Break / Posters / Exhibition |
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Session 3 - Simulation and Modelling |
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Chairperson: Christophe Detavernier |
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11:20-11:50 |
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INVITED |
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Material-electrical modeling of interconnect: challenges and opportunities |
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Tommaso Rollo,
Applied Materials Inc., Italy |
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11:50-12:10 |
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Simulation of Si Epitaxy in Single Wafer Reactors |
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Andreas Zienert,
Fraunhofer ENAS, Germany |
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12:10-12:30 |
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Investigating local stoichiometry fluctuations in nm-thin semiconductor alloys: a case study on SiGe |
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Daniel Dick,
Chemnitz University of Technology , Germany |
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Session 4 - Packaging & 2.5/3D Integration |
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Chairperson: Takayuki Ohba |
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14:00-14:30 |
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INVITED |
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Hi-Temperature Lifetime Capability of CuAl Intermetallic Joints: Comparative Study of Pure and Alloyed Copper Wires through Electrical and Physical Methods |
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Alberto Mancaleoni,
STMicroelectronics, Italy |
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14:30-14:50 |
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Bond Front Kinetics and Adherence of Direct Wafer Bonding in Dielectric-Dielectric Interfaces |
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Sai Swaroop Akaram,
Fraunhofer ENAS, Germany |
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14:50-15:20 |
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INVITED |
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Next-Generation Electrolytes for High-Precision Micro Bump Integration |
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Himendra Jha,
MKS/ATOTECH, Germany |
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15:20-15:40 |
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Development of the Aluminium Hybrid Bonding |
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Imants Cirulis,
Fraunhofer ENAS, Germany |
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15:40-16:10 |
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INVITED |
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Chip-on-Wafer Integration Technology for Silicon Capacitor Embedded 3D Functional Interposer |
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Tatsuya Funaki,
Institute of Science Tokyo and Murata Manufacturing Co., Ltd., Japan |
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16:10-17:45 |
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Poster Session / Exhibition (incl. coffee, drinks and fingerfood) |
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